One of the main features of the SPICE language is the ability to define subcircuits using the .SUBCKT directive. This feature allows users to create reusable modules to simplify the design of complex ...

Physical AI, machine learning, and edge computing are some of the latest technologies that are reshaping robotics and autonomous system design, enabling these systems to interact more intelligently ...

The AMD Ryzen AI Halo developer platform allows developers and engineers to build and train AI models with up to 200-billion parameters. The development platform is based on the AMD Ryzen AI MAX+ 395, ...

Sitting above the physical layer is the link layer, which is responsible for scanning, advertising, creating, and maintaining links or connections between devices. The link layer also manages ...

Artificial Intelligence (AI) has experienced unprecedented expansion in recent years. The spread of AI tools has exceeded the boundaries of data centers and high-performance devices to enter embedded ...

Here’s a roundup of this week’s must-read articles. We’ll look into the latest developments on smart robots, simplifying audio complexity, building Simulink models with agentic AI, and Cadence’s ...

Engineering teams therefore need ways to combine the speed of AI with structured development practices that support verification at every step. Without that, teams trade short-term speed for long-term ...

The Ethernet Alliance has publicly released its 2026 Ethernet Roadmap, covering the technologies, trends, and innovations that will define next-generation high-performance, AI-driven networking.

“RISC-V is poised for a Big 2025” Said Andrew Gallo (V.P. RISC-V International), quoting VDC Research, at the European RISC-V Summit 2025. Major industry players are eager to expand their product ...

The trial production of its next-generation Exynos 2600 processor has reached a 30% yield rate. If yield improvements progress smoothly, mass production could begin in Q4 2025, putting it in direct ...

The hardware verification gap nobody measures—what AI gets right when it generates your testbench and what it misses.

The surge in complexity of modern SoCs, driven by the integration of heterogeneous compute elements, advanced packaging techniques, and stringent power and performance demands, has led to an ...